Nanoscale 3D Xray Inspection Equipment For PCBA Boards CE Certified

1.Equipment characteristics:
2D/2.5D imaging can achieve multi-axis linkage imaging function for ROI;
With imaging enhancement function; With automatic analysis function;
With image analysis function; With scanning programming function;
Optional rotating disk imaging module for more Angle observation;
3D imaging detection is realized for local devices on the whole board.
For small devices, optional turntable and cone-beam CT imaging functions are available.

2.Detection application:
Large size PCBA board
Internal structural quality of semiconductor packaging products
SMT welding quality of various types of solder joints, such as open welding, whether there is infiltration, solder amount, offset, foreign body, bridge, pin and so on

3.Basic Parameters

X-ray Source Parameters

Detector parameter

Equipment Performance Parameters Details 

Nanoscale 3D Xray Inspection Equipment

CE certified 3D Xray Inspection

CE 3d industrial x ray

Nanoscale 3D Xray Inspection Equipment For PCBA Boards CE Certified Images